http://ir.sinica.edu.tw/handle/201000000A/48781
題名: | Silver as a highly effective bonding layer for lead telluride thermoelectric modules assembled by rapid hot-pressing | 作者: | C. C. Li F. Drymiotis L. L. Liao M. J. Dai C. K. Liu C. L. Chen Y. Y. Chen C. R. Kao G. J. Snyder |
公開日期: | 2014-04 | 關聯: | ENERGY CONVERSION AND MANAGEMENT 98, 134-137, 2015 | URI: | http://ir.sinica.edu.tw/handle/201000000A/48781 | ISSN: | http://gateway.isiknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=Drexel&SrcApp=hagerty_opac&KeyRecord=0196-8904&DestApp=JCR&RQ=IF_CAT_BOXPLOT |
顯示於: | 物理研究所 |
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