Silver as a highly effective bonding layer for lead telluride thermoelectric modules assembled by rapid hot-pressing

Please use this identifier to cite or link to this item: http://ir.sinica.edu.tw/handle/201000000A/48781

Title:	Silver as a highly effective bonding layer for lead telluride thermoelectric modules assembled by rapid hot-pressing
Authors:	C. C. Li F. Drymiotis L. L. Liao M. J. Dai C. K. Liu C. L. Chen Y. Y. Chen C. R. Kao G. J. Snyder
Issue Date:	2014-04
Relation:	ENERGY CONVERSION AND MANAGEMENT 98, 134-137, 2015
URI:	http://ir.sinica.edu.tw/handle/201000000A/48781
ISSN:	http://gateway.isiknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=Drexel&SrcApp=hagerty_opac&KeyRecord=0196-8904&DestApp=JCR&RQ=IF_CAT_BOXPLOT
Appears in Collections:	物理研究所

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