Effect of copper content on the electrical stability of nickel oxide films

Please use this identifier to cite or link to this item: http://ir.sinica.edu.tw/handle/201000000A/48726

Title:	Effect of copper content on the electrical stability of nickel oxide films
Authors:	S. C. Chen T. Y. Kuo S. U. Jen H. P. Chiang W. Y. Liu C. H. Wang
Issue Date:	2015-04
Relation:	THIN SOLID FILMS 584, 238-242
URI:	http://ir.sinica.edu.tw/handle/201000000A/48726
ISSN:	http://gateway.isiknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=Drexel&SrcApp=hagerty_opac&KeyRecord=0040-6090&DestApp=JCR&RQ=IF_CAT_BOXPLOT
Appears in Collections:	物理研究所

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