Effect of Applied Potential on the Chemical-Mechanical Polishing of Aluminum in Phosphoric Acid Base Slurry

Please use this identifier to cite or link to this item: http://ir.sinica.edu.tw/handle/201000000A/46615

Title:	Effect of Applied Potential on the Chemical-Mechanical Polishing of Aluminum in Phosphoric Acid Base Slurry
Authors:	Kuo, Hong-Shi Tsai, Wen-Ta
Issue Date:	2000
Relation:	JOURNAL OF THE ELECTROCHEMICAL SOCIETY147( 6), 2136
URI:	http://ir.sinica.edu.tw/handle/201000000A/46615
Appears in Collections:	物理研究所

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