5 nm Ruthenium Thin Film as a Directly Plateable Copper Diffusion Barrier

Please use this identifier to cite or link to this item: http://ir.sinica.edu.tw/handle/201000000A/43874

Title:	5 nm Ruthenium Thin Film as a Directly Plateable Copper Diffusion Barrier
Authors:	Arunagiri, T. N. Zhang, Y. Chyan, O. El-Bounani, M. Kim, M. J. Wu, C. T. Chen, L. C. Chen, K. H.
Issue Date:	2005
Relation:	APPLIED PHYSICS LETTERS 86,083104
URI:	http://ir.sinica.edu.tw/handle/201000000A/43874
ISSN:	http://gateway.isiknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=Drexel&SrcApp=hagerty_opac&KeyRecord=0003-6951&DestApp=JCR&RQ=IF_CAT_BOXPLOT
Appears in Collections:	原子與分子科學研究所

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