TDDB Reliability Improvement of Cu Damascene with a Bilayer-Structured a-SiC:H Dielectric Barrier

Please use this identifier to cite or link to this item: http://ir.sinica.edu.tw/handle/201000000A/34025

Title:	TDDB Reliability Improvement of Cu Damascene with a Bilayer-Structured a-SiC:H Dielectric Barrier
Authors:	C.C. Chiang M.C. Chen Z.C. Wu L.J. Li S.M. Jang M.S. Liang
Issue Date:	2004
Relation:	JOURNAL OF THE ELECTROCHEMICAL SOCIETY 151, G89
URI:	http://ir.sinica.edu.tw/handle/201000000A/34025
ISSN:	http://gateway.isiknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=Drexel&SrcApp=hagerty_opac&KeyRecord=0013-4651&DestApp=JCR&RQ=IF_CAT_BOXPLOT
Appears in Collections:	應用科學研究中心

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