| Issue Date | Title | Author(s) | Relation | scopus | WOS | Fulltext/Archive link |
|---|---|---|---|---|---|---|
| 2004 | Effects of O2- and N2-Plasma Treatments on Copper Surface | C.C. Chiang; M.C. Chen; L.J. Li; Z.C. Wu; S.M. Jang; M.S. Liang | JAPANESE JOURNAL OF APPLIED PHYSICS 43, 7415 | |||
| 2001 | Leakage mechanism in Cu damascene structure with methylsilane-doped low-k CVD oxide as intermetal dielectrics | Z.C. Wu; C.C. Chiang; W.H. Wu; M.C. Chen; S. M. Jeng; L.J. Li; S. M. Jang; C.H. Yu; M.S. Liang | IEEE ELECTRON DEVICE LETTERS 22, 263 | |||
| 2004 | Physical and Barrier Properties of Amorphous Silicon-Oxycarbide Deposited by PECVD from Octamethylcyclotetrasiloxane | C.C. Chiang; M.C. Chen; L.J. Li; Z.C. Wu; S.M. Jang; M.S. Liang | JOURNAL OF THE ELECTROCHEMICAL SOCIETY 151, G612 | |||
| 2004 | TDDB Reliability Improvement of Cu Damascene with a Bilayer-Structured a-SiC:H Dielectric Barrier | C.C. Chiang; M.C. Chen; Z.C. Wu; L.J. Li; S.M. Jang; M.S. Liang | JOURNAL OF THE ELECTROCHEMICAL SOCIETY 151, G89 |
