| Issue Date | Title | Author(s) | Relation | scopus | WOS | Fulltext/Archive link |
|---|---|---|---|---|---|---|
| 2017 | Recrystallization of copper at a solid interface for improved CVD graphene growth | Ya-Ping Hsieh; Ding-Rui Chen; Wan-Yu Chiang; Kai-Jyun Chen; Mario Hofmann | RSC Advances 7(7), 3736-3740 | |||
| 2021 | Two-Dimensional Mechano-thermoelectric Heterojunctions for Self-Powered Strain Sensors | Ying-Yu Wang; Ding-Rui Chen; Jen-Kai Wu; Tian-Hsin Wang; Chiashain Chuang; Ssu-Yen Huang; Wen-Pin Hsieh ; Mario Hofmann; Yuan-Huei Chang; Ya-Ping Hsieh | Nano Letters 21(16), 6990-6997 |
