Modelling electrical conduction in nanostructure assemblies through complex networks

Please use this identifier to cite or link to this item: http://ir.sinica.edu.tw/handle/201000000A/81428

Title:	Modelling electrical conduction in nanostructure assemblies through complex networks
Authors:	Yao, Heming Hsieh, Ya-Ping Kong, Jing Hofmann, Mario
Issue Date:	2020-07
Relation:	Nature Materials 19, 745-751
URI:	http://ir.sinica.edu.tw/handle/201000000A/81428
ISSN:	http://gateway.isiknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=Drexel&SrcApp=hagerty_opac&KeyRecord=1476-1122&DestApp=JCR&RQ=IF_CAT_BOXPLOT
URL:	http://dx.doi.org/10.1038/s41563-020-0664-1
Appears in Collections:	原子與分子科學研究所

Show full item record

Last Week
0

Last month
0

checked on Jan 4, 2023

Check