http://ir.sinica.edu.tw/handle/201000000A/81428
Title: | Modelling electrical conduction in nanostructure assemblies through complex networks | Authors: | Yao, Heming Hsieh, Ya-Ping Kong, Jing Hofmann, Mario |
Issue Date: | 2020-07 | Relation: | Nature Materials 19, 745-751 | URI: | http://ir.sinica.edu.tw/handle/201000000A/81428 | ISSN: | http://gateway.isiknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=Drexel&SrcApp=hagerty_opac&KeyRecord=1476-1122&DestApp=JCR&RQ=IF_CAT_BOXPLOT | URL: | http://dx.doi.org/10.1038/s41563-020-0664-1 |
Appears in Collections: | 原子與分子科學研究所 |
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