http://ir.sinica.edu.tw/handle/201000000A/48605
Title: | Carrier Engineering of Bulk Bi0.5Sb1.5Te3Thermoelectric Properties by Copper Inclusion | Authors: | Lan, T. W. Chang, C. C. Chien, Y. C. Tseng, C. M. Hsieh, Y. T. Wu, Y. R. Wen, M. H. Lee, T. K. Wu, M. K. Chen, Y. Y. |
Issue Date: | 2015-01 | Relation: | Physical Chemistry Chemical Physics | URI: | http://ir.sinica.edu.tw/handle/201000000A/48605 | ISSN: | http://gateway.isiknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=Drexel&SrcApp=hagerty_opac&KeyRecord=1463-9076&DestApp=JCR&RQ=IF_CAT_BOXPLOT |
Appears in Collections: | 物理研究所 |
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