http://ir.sinica.edu.tw/handle/201000000A/39616
Title: | Number of Vias: A Control Parameter for Global Wiring of High Density Chips | Authors: | Lee, D. T. Hong, S. J. Wong, C. K. |
Issue Date: | 1981-07-01 | Relation: | IBM J. Res. and Develop. 25, 261-271 | URI: | http://ir.sinica.edu.tw/handle/201000000A/39616 |
Appears in Collections: | 資訊科學研究所 |
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