RePAIR: A ReRAM-based Processing-in-Memory Accelerator for Indel Realignment

Please use this identifier to cite or link to this item: http://ir.sinica.edu.tw/handle/201000000A/85281

Title:	RePAIR: A ReRAM-based Processing-in-Memory Accelerator for Indel Realignment
Authors:	Ting Wu Chin-Fu Nien Kuang-Chao Chou Hsiang-Yun Cheng
Issue Date:	2022-03
Conference:	IEEE/ACM Design, Automation Test in Europe (DATE)
URI:	http://ir.sinica.edu.tw/handle/201000000A/85281
Appears in Collections:	資訊科技創新研究中心

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