Effect of Alumina and Hydrogen Peroxide on the Chemical-Mechanical Polishing of Aluminum in Phosphoric Acid Base Slurry

Please use this identifier to cite or link to this item: http://ir.sinica.edu.tw/handle/201000000A/46614

Title:	Effect of Alumina and Hydrogen Peroxide on the Chemical-Mechanical Polishing of Aluminum in Phosphoric Acid Base Slurry
Authors:	Kuo, Hong-Shi Tsai, Wen-Ta
Issue Date:	2001
Relation:	MATERIALS CHEMISTRY AND PHYSICS69(1-3), 53
URI:	http://ir.sinica.edu.tw/handle/201000000A/46614
Appears in Collections:	物理研究所

Show full item record

Last Week
0

Last month

checked on Jan 2, 2023

Check