Bonding characterization, density measurement, and thermal diffusivity studies of amorphous silicon carbon nitride and boron carbon nitride thin films

Please use this identifier to cite or link to this item: http://ir.sinica.edu.tw/handle/201000000A/43998

Title:	Bonding characterization, density measurement, and thermal diffusivity studies of amorphous silicon carbon nitride and boron carbon nitride thin films
Authors:	Chattopadhyay, S. Chen, L. C. Chien, S. C. Lin, S. T. Chen, K. H.
Issue Date:	2002
Relation:	JOURNAL OF APPLIED PHYSICS 92, 5150-5158
URI:	http://ir.sinica.edu.tw/handle/201000000A/43998
ISSN:	http://gateway.isiknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=Drexel&SrcApp=hagerty_opac&KeyRecord=0021-8979&DestApp=JCR&RQ=IF_CAT_BOXPLOT
Appears in Collections:	原子與分子科學研究所

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