Layer Assignment for Multi-Chip Modules

Please use this identifier to cite or link to this item: http://ir.sinica.edu.tw/handle/201000000A/40009

Title:	Layer Assignment for Multi-Chip Modules
Authors:	Ho, Jan-Ming Sarrafzadeh, M. Vijayan, G. Wong, C. K.
Issue Date:	1990-12-01
Relation:	IEEE Trans. on Computer-Aided Design of Integrated Circuits and Systems , 1272-1277
URI:	http://ir.sinica.edu.tw/handle/201000000A/40009
Appears in Collections:	資訊科學研究所

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