| Issue Date | Title | Author(s) | Relation | scopus | WOS | Fulltext/Archive link |
|---|---|---|---|---|---|---|
| 2014 | Heterogeneously integrated sub-40nm low-power epi-like Ge/Si monolithic 3D-IC with stacked SiGeC ambient light harvester | Chang-Hong Shen; Jia-Min Shieh; Wen-Hsien Huang; Tsung-Ta Wu; Chien-Fu Chen; Ming-Hsuan Kao; Chih-Chao Yang; Chein-Din Lin; Hsing-Hsiang Wang; Tung-Ying Hsieh; Bo-Yuan Chen; Guo-Wei Huang; Meng-Fan Chang; Fu-Liang Yang | ||||
| 2015 | Low-Cost and TSV-free Monolithic 3D-IC with Heterogeneous Integration of Logic, Memory and Sensor Analogy Circuitry for Internet of Things | Tsung-Ta Wu; Chang-Hong Shen; Jia-Min Shieh; Wen-Hsien Huang; Hsing-Hsiang Wang; Fu-Kuo Hsueh; Hisu-Chih Chen; Chih-Chao Yang; Tung-Ying Hsieh; Bo-Yuan Chen; Yu-Shao Shiao; Chao-Shun Yang; Guo-Wei Huang; Kai-Shin Li; Ting-Jen Hsueh; Chien-Fu Chen; Wei-Hao Chen; Fu-Liang Yang; Meng-Fan Chang; Wen-Kuan Yeh |
