| Issue Date | Title | Author(s) | Relation | scopus | WOS | Fulltext/Archive link |
|---|---|---|---|---|---|---|
| 2014 | Hybrid Si/TMD 2D Electronic Double Channels Fabricated Using Solid CVD Few-Layer-MoS2 Stacking for Vth Matching and CMOS-Compatible 3DFETs | Min-Cheng Chen; Chia-Yi Lin; Kai-Hsin Li; Lain-Jong Li; Chang-Hsiao Chen; Cheng-Hao Chuang; Ming-Dao Lee; Yi-Ju Chen; Yun-Fang Hou; Chang-Hsien Lin; Chun-Chi Chen; Bo-Wei Wu; Cheng-San Wu; Ivy Yang; Yao-Jen Lee; Wen-Kuan Yeh; Tahui Wang; Fu-Liang Yang; Chenming Hu | ||||
| 2014 | Low-Temperature Microwave Annealing Processes for Future IC Fabrication—A Review | Yao-Jen Lee; Ta-Chun Cho; Shang-Shiun Chuang; Fu-Kuo Hsueh; Yu-Lun Lu; Po-Jung Sung; Hsiu-Chih Chen; Michael I. Current; Tseung-Yuen Tseng; Tien-Sheng Chao; Chenming Hu; Fu-Liang Yang | IEEE TRANSACTIONS ON ELECTRON DEVICES 61, NO.3 | |||
| 2015 | Sub-60mV-Swing Negative-Capacitance FinFET without Hysteresis | Kai-Shin Li; Pin-Guang Chen; Tung-Yan Lai; Chang-Hsien Lin; Cheng-Chih Cheng; Chun-Chi Chen; Yun-Jie Wei; Yun-Fang Hou; Ming-Han Liao; Min-Hung Lee; Min-Cheng Chen; Jia-Min Sheih; Wen-Kuan Yeh; Fu-Liang Yang; Sayeef Salahuddin; Chenming Hu | ||||
| 2015 | TMD FinFET with 4 nm Thin Body and Back Gate Control for Future Low Power Technology | Min-Cheng Chen; Kai-Shin Li; Lain-Jong Li; Ang-Yu Lu; Ming-Yang Li; Yung-Huang Chang; Chang-Hsien Lin; Yi-Ju Chen; Yun-Fang Hou; Chun-Chi Chen; Bo-Wei Wu; Cheng-San Wu; Ivy Yang; Yao-Jen Lee; Jia-Min Shieh; Wen-Kuan Yeh; Jyun-Hong Shih; Po-Cheng Su; Angada B. Sachid; Tahui Wang; Fu-Liang Yang; Chenming Hu |
