Issue Date | Title | Author(s) | Relation | scopus | WOS | Fulltext/Archive link |
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2020 | Highly Conductive Nanometer-Thick Gold Films Grown on Molybdenum Disulfide Surfaces for Interconnect Applications | Yu-Wei Zhang; Bo-Yu Wu; Kuan-Chao Chen; Chao-Hsin Wu; Shih-Yen Lin | SCIENTIFIC REPORTS 10, 14463 | |||
2017 | Layer Number Controllability of Transition-metal Dichalcogenides and The Establishment of Hetero-structures by Using Sulfurization of Thin Transition Metal Films | Kuan-Chao Chen; Tung-Wei Chu; Chong-Rong Wu; Si-Chen Lee; Shih-Yen Lin | ||||
2016 | MoS2 Growth by Using Sulfurization of Molybdenum Films with Different Thicknesses | Tung-Wei Chu; Kuan-Chao Chen; Chao-Hsin Wu; Si-Chen Lee; Shih-Yen Lin | ||||
2019 | Multi-layer elemental 2D materials: antimonene, germanene and stanene grown directly on molybdenum disulfides | Kuan-Chao Chen; Lun-Ming Lee; Hsuan-An Chen; Hsu Sun; Cheng-Lun Wu; Hsin-An Chen; Kuan-Bo Lin; Yen-Chun Tseng; Chao-Cheng Kaun ; Chun-Wei Pao ; Shih-Yen Lin | Semiconductor Science and Technology 34(10), 105020 | |||
2020 | Stacked 2D, 3D and Amorphous Structures for Device Applications | Shih-Yen Lin ; Kuan-Chao Chen; Yu-Wei Zhang; Po-Cheng Tsai | ||||
2019 | The atomic layer etching of molybdenum disulfides using low-power oxygen plasma | Kuan-Chao Chen; Chia-Wei Liu; Chi Chen; Shih-Yen Lin | Semiconductor Science and Technology 34(4), 045007 | |||
2017 | The Band Alignment of Different 2D Materials: Vertical and Planar MoS2/WS2 Hetero-structures | Jui-Tse Tang; Kuan-Chao Chen; Chao-Hsin Wu; Shih-Yen Lin | ||||
2020 | The Device Application of Germanene Grown by Thermal Evaporation | Bo-Ying Chen; Yu-Wei Zhang; Kuan-Chao Chen; Si-Chen Lee; Shih-Yen Lin | ||||
2018 | Two-dimensional Tin Grown on Molybdenum Disulfides | Lun-Ming Lee; Kuan-Chao Chen; Yi-Jia Chen; Shih-Yen Lin | ||||
2020 | Van der Waals Epitaxy of Large-area and Single-crystalline Gold Films on MoS2 for Low-Contact-Resistance 2D-3D Interfaces | Kuan-Chao Chen; Syuan-Miao Lai; Bo-Yu Wu; Chi Chen; Shih-Yen Lin | ACS Applied Nano Materials 3(3), 2997-3003 |