Issue Date | Title | Author(s) | Relation | scopus | WOS | Fulltext/Archive link |
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2004 | TDDB Reliability Improvement of Cu Damascene with a Bilayer-Structured a-SiC:H Dielectric Barrier | C.C. Chiang; M.C. Chen; Z.C. Wu; L.J. Li; S.M. Jang; M.S. Liang | JOURNAL OF THE ELECTROCHEMICAL SOCIETY 151, G89 |